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HP 578349-L21 2.26GHz 2.5GT/s DMI 2MB L3 SmartCache Socket LGA1156 Intel Celeron G1101 2-Core Processor
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Description
Specification
Reviews
Description
Product Features:
- Intel® Celeron® G G1101 2.26 GHz
- 2 MB Smart Cache LGA 1156 (Socket H)
- Processor cores: 2 32 nm 64-bit 73 W
- 16.38 GB DDR3-SDRAM
- On-board graphics card
HPE Intel Celeron G1101 processor 2.26 GHz 2 MB Smart Cache
Intel Celeron G1101, 2M Cache, 2.26 GHz, 2.5 GT/s
HPE Intel Celeron G1101, Intel® Celeron® G, LGA 1156 (Socket H), 32 nm, G1101, 2.26 GHz, 64-bit
HPE Intel Celeron G1101. Processor family: Intel® Celeron® G, Processor socket: LGA 1156 (Socket H), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16.38 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card base frequency: 533 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, Number of Processing Die Transistors: 382 M. Compatibility: ML110 G6
Specification
Processor
Processor model
G1101
Processor base frequency
2.26 GHz
Processor family
Intel® Celeron® G
Processor cores
2
Processor socket
LGA 1156 (Socket H)
Component for
PC
Processor lithography
32 nm
Processor series
Intel Celeron Processor G1000 Series for Desktop
Processor threads
2
System bus rate
2.5 GT/s
Processor operating modes
64-bit
Processor cache
2 MB
Processor cache type
Smart Cache
Thermal Design Power (TDP)
73 W
Stepping
K0
Bus type
DMI
Memory bandwidth supported by processor (max)
17 GB/s
Memory
Maximum internal memory supported by processor
16.38 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
1066 MHz
Memory channels
Dual-channel
ECC
Graphics
On-board graphics card
On-board graphics card base frequency
533 MHz
Number of displays supported (on-board graphics)
2
Features
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Market segment
Desktop
Maximum number of PCI Express lanes
1
PCI Express slots version
2.0
PCI Express configurations
1x16, 2x8
Number of Processing Die Transistors
382 M
Processing Die size
81 mm²
Physical Address Extension (PAE)
CPU configuration (max)
1
Embedded options available
Physical Address Extension (PAE)
36 bit
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Turbo Boost Technology
Intel FDI Technology
Intel® AES New Instructions (Intel® AES-NI)
Enhanced Intel SpeedStep Technology
Intel Trusted Execution Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Demand Based Switching
Intel 64
Intel Virtualization Technology (VT-x)
Intel Virtualization Technology for Directed I/O (VT-d)
Intel® vPro™ Platform Eligibility
Other features
Compatibility
ML110 G6