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HP Intel Xeon E5-2670 v2 processor 2.5 GHz 25 MB L3
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Description
Specification
Reviews
Description
Product Features:
- Intel® Xeon® E5 V2 Family E5-2670V2 2.5 GHz
- 25 MB L3 LGA 2011 (Socket R)
- Processor cores: 10 22 nm 32-bit, 64-bit 115 W
- Maximum internal memory supported by processor: 768 GB DDR3-SDRAM
HP Intel Xeon E5-2670 v2 processor 2.5 GHz 25 MB L3
HP Intel Xeon E5-2670 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Scalability: 2S. Package width: 52.5 mm, Package depth: 51 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
Specification
Processor
Processor manufacturer
Intel
Processor model
E5-2670V2
Processor base frequency
2.5 GHz
Processor family
Intel® Xeon® E5 V2 Family
Processor cores
10
Processor socket
LGA 2011 (Socket R)
Component for
Server/workstation
Processor lithography
22 nm
Processor threads
20
System bus rate
8 GT/s
Processor operating modes
32-bit, 64-bit
Processor boost frequency
3.3 GHz
Processor cache
25 MB
Processor cache type
L3
Thermal Design Power (TDP)
115 W
VID Voltage Range
0.65 - 1.30 V
Bus type
QPI
Number of QPI links
2
Memory bandwidth supported by processor (max)
59.7 GB/s
Memory
Maximum internal memory supported by processor
768 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
800,1066,1333,1600,1866 MHz
Memory channels
Quad-channel
ECC
Graphics
On-board graphics card
Discrete graphics card
On-board graphics card model
Not available
Discrete graphics card model
Not available
Features
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Market segment
Server
PCI Express slots version
3.0
Scalability
2S
Embedded options available
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Identity Protection Technology (Intel® IPT)
Intel® Turbo Boost Technology
2.0
Intel Flex Memory Access
Intel® Smart Cache
Intel® AES New Instructions (Intel® AES-NI)
Enhanced Intel SpeedStep Technology
Intel Trusted Execution Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Demand Based Switching
Intel® Secure Key
Intel TSX-NI
Intel Virtualization Technology (VT-x)
Intel Virtualization Technology for Directed I/O (VT-d)
Intel® vPro™ Platform Eligibility
Operational conditions
Tcase
82 °C
Packaging data
Package width
52.5 mm
Package depth
51 mm
Other features
Intel® Virtualization Technology (Intel® VT)
VT-d, VT-x